1ATRL-0

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ATR chassis provides the highest level of environmental protection combined with exceptional packing density and thermal performance. Boards are clamped in place using expanding screw driven wedgelock assemblies and cooling is entirely by conduction through internal chassis walls. No cooling air passes over the boards themselves and as a result they are completely protected from airborne contaminants. Heat is extracted from the chassis by air or liquid being passed through sidewall heat exchangers or by conduction to a suitable cold-plate.

Level 4 and 5 conduction-cooled boards meet IEEE 1101.2-1992. The ATRs will accept boards from any vendor meeting this international standard. All our chassis products are backed up by a range of integration services. During the early design phase these include thermal modeling, mechanical adaptation and electronic interface design. Then, as the program moves on, software engineering is on hand to support development, provide system level Built-In-Test (BIT) and where necessary integrate third party boards and peripherals.

Finally, dedicated teams of engineers provide ILS data, qualification support, obsolescence management and through life support. A one-stop shop for an out-of-the-box and ready-to-run solution.

Former Radstone Product Search Radstone Manuals PLM Program

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